| ..= SMD type = | ||||
| .Model Name | .Package & Size(mm) | . . . .Features | .Freq. Range | . . . . .Views |
| HP-TC2520 | . Metal Lid+Ceramic PKG . 2.5×2.0×0.9 mm |
..Temperature Compensated . . (±2.5ppm) ..C-MOS out ..Tri-state Function |
. 4.0 to 54.0 MHz |
..... |
| HP-TC3225 | . Metal Lid+Ceramic PKG . 3.2×2.5×1.0 mm |
..Temperature Compensated . . (±2.5ppm) ..C-MOS out ..Tri-state Function |
. 4.0 to 54.0 MHz | ...... |
| HP-TC5032 | . Metal Lid+Ceramic PKG . 5.0×3.2×1.05 mm |
..Temperature Compensated . . (±2.5ppm) ..C-MOS out ..Tri-state Function |
. 4.0 to 54.0 MHz |
. ... |
| HP-TC7050 | . Metal Lid+Ceramic PKG . 7.0×5.0×1.5 mm |
..Temperature Compensated . . (±2.5ppm) ..C-MOS out ..Tri-state Function |
. 4.0 to 54.0 MHz | .... |
| . = Tape & Reel Dimensions / Reflow Heat Conditions = | ||||
..*Tape & Reel Dimensions..  ..*.Reflow Heat Conditions... |
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